Size (mm) | L x W=1.0 x 0.8 T=0.30 Max. |
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Frequency Range (MHz) | In Mass Production 37.4, 40, 59.97 Under Development 38.4, 48, 76.8 |
Initial Frequency Deviation | +/- 10ppm (@+25℃) |
Frequency Temperature Characteristics | +/- 12ppm (-30 to +85℃) |
I. Overview
In recent years, the mounting density of electronic devices has increased due to the increasing number of functions of communication terminals for 5G communications, faster Wi-Fi®, and the electrification of onboard components. In addition, due to the limited space available in the mounting area, the size of mounted components is becoming smaller.
Among them, Kyocera developed excellent photolithography and ultra-high precision machining technology jointly with Osaka University (Plasma CVM technology: details here), and we have succeeded in mass-producing an ultra-small crystal unit, the CX1008SB Series.
Wi-Fi® is a registered trademark of Wi-Fi Alliance.
Bluetooth® is a registered trademark of Bluetooth SIG, Inc.
II. Series Resistance
37.4 MHz | 38.4 MHz | 40 MHz | 48 MHz | 59.97 MHz | 76.8 MHz |
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60Ω Max. | 60Ω Max. | 60Ω Max. | 60Ω Max. | 50Ω Max. | 35Ω Max. |
III. Applications
GNSS, 5G millimeter-wave compatible smartphones, Wi-Fi® module, etc.
Quantity | Unit Price | Extended Price |
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1+ | 0 | 0 |