Features
- Available for LTE, HSPA+, HSPA+ and EV-DO networks
- Form factor: Available in PCI Express Mini Card for industrial applications and mobile computing
- Industrial temperature range*
- Supports Windows® 7, Windows® 8, and Linux operating systems
- Dimentions: 51 x 30 x 2.7mm
- Supply voltage: 3.4 - 4.2 V
View detail
Ideal for industrial M2M and mobile computing solutions, AirPrime® MC embedded modules deliver high speed connectivity, with a wide selection of advanced air interfaces, including LTE frequencies. Based on the PCI Express Mini Card standard with a USB 2.0 interface, the MC Series modules offer an easy upgrade path to new network technologies and global access to high speed networks
Key Benefits
- Easy to integrate: Standard PCI Express Mini Card form factor with industrial specifications*
- High-speed cellular connectivity with the latest technologies and multi-operator support
- Easy upgrade path to new network technologies
Price list
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