I. Product Advantages
The product is compact and requires less PCB space.
The product complies with JEDEC pin standards.
II. Product Parameter
| Product Series | NAND Flash | Capacity | Package | Operating Temperature | Protocol | Interface | Operating Voltage | Size |
| Subsize eMMC | MLC | 4GB | 153Ball | -25℃~85℃ | eMMC 5.1 | HS400 | 3.3V/1.8V | 9*7.5*0.8 mm / 9*10*0.8mm / 10*11*0.8 mm |
| Subsize eMMC | MLC | 8GB | 153Ball | -25℃~85℃ | eMMC 5.1 | HS400 | 3.3V/1.8V | 9*7.5*0.8 mm / 9*10*0.8mm / 10*11*0.8 mm |
| Subsize eMMC | TLC | 32GB | 153Ball | -25℃~85℃ | eMMC 5.1 | HS400 | 3.3V/1.8V | 9*7.5*0.8 mm / 9*10*0.8mm / 10*11*0.8 mm |
III. Product Features
- The product is downward compatible with standard industry protocols and is small and thin.
- When compared with the eMMC with a standard size, the FORESEE subsize eMMC can save 40% to 55% PCB space.
- Based on insights to Flash and application scenarios, the FORESEE subsize eMMC further reduces power consumption.
- The product is suitable for application scenarios with limited space, such as wearable devices.
IV. Application: Smart watch, Smart band, Smart earphone, Industrial IPC
V. Compatible Platforms
| Number | Platform |
| 1 | Qualcomm |
| （The product supports mainstream platforms and only part of it is shown here.） | |
Reference source: https://www.longsys.com/products/embedded-storage/embedded-storage/subsize-emmc.html