I. Product Advantages
The product is highly integrated and compact, saving PCB space.
The low-power design helps wearable devices extend their standby time.
The product provides various capacity combinations, such as 8GB+4Gb and 8GB+8Gb.
II. Product Parameter
| Product Series | Protocol | Capacity | DRAM Frequency | Package | Operating Temperature | Size | Operating Voltage |
|---|---|---|---|---|---|---|---|
| ePOP3 | eMMC5.1+LPDDR3 | 8GB+8Gb | 800MHz | 136ball | -25℃~85℃ | 10*10*0.9 mm | DRAM: VDD1=VDD2=1.8V |
| ePOP3 | eMMC5.1+LPDDR3 | 32GB+8Gb | 800MHz | 136ball | -25℃~85℃ | 10*10*0.9 mm | VDDQ=1.2V; eMMC: VCC : 2.7~3.6V |
| ePOP3 | eMMC5.1+LPDDR3 | 64GB+8Gb" | 800MHz | 136ball | -25℃~85℃ | 10*10*0.9 mm | VCCQ: 1.7~1.95V/2.7~3.6V |
| ePOP4x | eMMC5.1+LPDDR4x | 32GB+16Gb | 2133MHz | 144ball | -25℃~85℃ | 8*9.5*0.8 mm | DRAM: VDD1=VDD2=1.8V |
| ePOP4x | eMMC5.1+LPDDR4x | 64GB+16Gb | 2133MHz | 144ball | -25℃~85℃ | 8*9.5*0.8 mm | VDDQ=1.2V; |
III. Product Features
- The product has passed compatibility verification of multiple platforms.
- It supports field firmware update (FFU).
IV. Application: Smart watch, Smart band, Smart earphone
V. Compatible Platforms
|
Number |
Platform |
|
01 |
Qualcomm |
|
（The product supports mainstream platforms and only part of it is shown here.） |
|
Reference source: https://www.longsys.com/products/embedded-storage/embedded-storage/epop.html