The new capacitors have a novel metal-insulator-metal (MIM) structure & a wide range of capacitance values, & are developed using a high-frequency structure simulator (HFSS) to deliver the highest possible RF performance & reliability.
Lately, GigaDevice Semiconductor officially released the GD32E230 series of Arm® Cortex®-M23 based MCUs bringing designers the advantages of small size, low cost, energy-efficiency and flexibility; while supporting security extension requirements to run the latest embedded application solutions.
In an increasingly connected world, the Internet of Things (IoT) is delivering business value and real-world benefits to individuals across the globe
Two of the most significant events for the eSIM global market—the 2nd World eSIM 2018 Summit and the Mobile World Congress—took place recently, giving us a chance to take the pulse of the global eSIM market.
Pulse Electronics has expanded its Chip Choke product range to include a 1210 size common mode choke for automotive applications.
Ultra-compact high reliability design eliminates heat generation, improving safety and energy savings in industrial equipment
MediaTek Helio M70 supports key 5G technologies including standalone (SA) and non-standalone (NSA) network architectures for faster connectivity - Lower latency and improved reference design deliver a high-speed network experience for the 5G era
Quectel Wireless Solutions, the leading global supplier of Internet of Things (IoT) modules, announced today that it has launched a new family of multi-mode Low Power Wide Area (LPWA) modules BG95 and BG77 based on the Qualcomm® 9205 LTE IoT modem.
MediaTek Helio P90 is designed with our most advanced AI solution to date - APU 2.0. With a leading fusion AI architecture, the Helio P90 handles the most complex AI apps and tasks while running multiple AI functions at the same time